// Technology & Process
Purity is not claimed. It's proven.
Gas purification and wafer crystal growth — with analytical verification at every step.
Gas Purification
How we reach 99.9999%.
01
TSA — Moisture Removal
Removes H₂O to below 10 ppb — the first and most critical purification step.
02
Catalytic Purification
Trace O₂ and CO removal to sub-ppb levels — essential for epitaxial growth and metal-gate deposition.
03
PSA — Bulk Separation
Pressure Swing Adsorption separates the target gas from residual contaminants.
04
Final Filtration
0.01 μm particulate filters before filling — prevents tool contamination.
05
Filling & Certification
Vacuum manifold filling. Every cylinder weighed, leak-tested, QC-sampled, and batch-traceable.
Analytical QC Lab
Every batch certified. Every cylinder traceable.
GC-TCD / FID / PDDTrace impurity to sub-ppm
RGA (Mass Spec)Residual gas species
FTIR SpectrometerMolecular fingerprinting
Moisture AnalyserH₂O below 1 ppb
ICP-MSMetallic trace impurities
Purification Technology Options
Choosing the right method per gas.
| Technology | Best For | CapEx Level | Purity Achievable |
|---|---|---|---|
| PSA | N₂, O₂, H₂ | Low | 5N–6N |
| TSA | Moisture removal | Low | Ppb moisture |
| Cryogenic Distillation | Ar, rare gases | High | 6N–7N |
| Catalytic Purification | O₂/H₂O traces | Medium | 7N+ |
Wafer Manufacturing Technology
From crystal to FOUP-packaged prime wafer.
01
Crystal Growth — CZ & PVT
Czochralski pulling (silicon); PVT seeded sublimation (SiC) at 2,200°C under controlled pressure.
02
Wafering
Multi-wire saw slicing with sub-100 μm kerf. Edge grinding to SEMI geometry.
03
Lapping & Planarization
Double-side lapping and CMP with process-specific slurry.
04
Clean & Passivation
Full RCA clean, HF dip, nitrogen-blown dry, ISO Class 4 packaging.
05
Metrology
XRD, LLS particle scan, resistivity mapping, micropipe inspection. SEMI M1/M55 compliant report.
Wafer Metrology Suite
Every wafer measured. Every parameter documented.
High-Res XRDCrystal quality, orientation
LLSSurface particle count
CV ProfilerCarrier concentration
Warp / BOW / TTVFull-wafer flatness
4-Point ProbeResistivity uniformity
Data-Driven Quality Systems
Applying software discipline to a chemical plant.
Every batch record, analytical result, and cylinder movement is logged digitally from Day 1 — not retrofitted after paper-based operations become the norm. This is a deliberate choice: real-time QC dashboards and predictive maintenance are far easier to build into a greenfield plant than to bolt onto an existing one.
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Real-Time QC Dashboards
Batch analytical results logged and trended automatically, flagging drift before it becomes an out-of-spec batch.
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Predictive Maintenance
Equipment sensor data monitored to schedule maintenance before failure, minimizing unplanned production downtime.
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End-to-End Traceability
Every cylinder, wafer, and chemical batch linked digitally from raw material intake to customer delivery record.
R&D Roadmap
What we're building next.
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Advanced Epitaxy
Investing in epitaxial process control for tighter doping uniformity across 200mm silicon and SiC substrates.
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Gas Recovery & Recycling
Evaluating NF₃ and Ar recovery systems to reduce raw material consumption and environmental footprint.
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Technology Licensing
In discussion with international specialty gas synthesis technology partners to accelerate Phase 3 timelines.
Need technical documentation?
SEMI-compliant analytical certificates, wafer metrology reports, safety data sheets, and process compatibility documentation.